13. The plastic deformation appeared on the ductility of a metal is often
(A) at a high degree,
(B) very little,
(C) not occurred,
(D) dependent, and
(E) all of the above

14. During recovery, the dislocations in the solid may be at the condition of (A) motion, (B) a high-energy configuration, (C) the increase of density, (D) transition to another type, and (E) all of the above.

15. What is the driving force for steady-state diffusion? (A) concentration gradient, (B) concentration, (C) electrical properties of materials, (D) diffusion coefficient, and (E) applied electric field.

16. What is the consideration for making integrated circuit interconnects normally by aluminum but not by copper, silver, or gold that have higher electrical conductivities? (A) diffusion, (B) melt temperature of metals, (C) cost price, (D) metal strength, and (E) metal ductibility.

17. The proportional limit in the stress-strain curve is the initial departure from linearity happens at (A) the fracture point of materials, (B) the range of elastic deformation, (C) the point of phase transformation, (D) the point of yielding, and (E) the melting point.

18. The smaller grains in metal materials may increase the material strength because (A) grain boundaries is the barrier for dislocation motion, (B) grain boundary may change the dislocation's direction of motion, (C) grain boundary may make the discontinuity of slop planes, (D) smaller grains have more grain boundaries, and (E) all of the above.

複選題19. The process of fatigue failure is characterized by the steps including (A) initial crack forms at the forced point once the load is applied, (B) the advancing creak from the initial stage has reached a critical size during the stress cycle, (C) the crack propagation is stopped by the plastic formation due to the interaction of dislocations, (D) increasing temperature owning to stress cycle melts the bend location, and (E) all of the above.

20. The most significant factor that affects the type of bonds of materials is (A) material chemistry, (B) material physics, (C) electronic configuration (D) Fermi level, and (E) atomic attractive force.

21. Vacancies play an important role in (A) deformation twinning, (B), cross-slip, (C) self-diffusion, (D), cold work, (E) re-crystallization.

22. Which is the type of dislocation belonging to among the defects in a crystal material: (A) point, (B) line, (C) boundary, (D) surface, (E) volume

23. Which material in the following can be strain-hardened after its plastic deformation at room temperature: (A) lead (Pb), (B) tin (Sn), (C) corundum (aluminum oxide), (D) steel (Fe), (E) polyethylene (PE).

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