35 電鍍製程(electroplating)是將欲鍍材料沉積到待鍍物上,其逆向製程為?
(A)化學加工(chemical machining)
(B)電化學加工(electrochemical machining)
(C)化學切削(chemical milling)
(D)放電加工(electrical-discharge machining)
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統計: A(50), B(865), C(88), D(208), E(0) #2018637
統計: A(50), B(865), C(88), D(208), E(0) #2018637