34 較常用於貴金屬合金的銲接用熔媒(soldering flux)是:
(A)硼酸或硼酸化合物(boric or borate compound)
(B)磷酸或磷酸化合物(phosphoric or phosphate compound)
(C)硫酸或硫酸化合物(sulphuric or sulphate compound)
(D)氟化合物(fluoride compound)

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統計: A(159), B(43), C(14), D(7), E(0) #2237917

詳解 (共 1 筆)

#6147706

于晏

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